ПЛАЗМЕННЫЕ ТЕХНОЛОГИИ
| 期 | 标题 | 文件 | |
| 卷 52, 编号 5 (2023) | The Influence of Small F2, H2, and HF Additives on the Concentration of Active Particles in Tetrafluoromethane Plasma |
 (Rus) |
|
| Efremov A., Smirnov S., Betelin V. | |||
| 卷 52, 编号 4 (2023) | Concentration of Fluorine Atoms and Kinetics of Reactive-Ion Etching of Silicon in CF4 + O2, CHF3 + O2, and C4F8 + O2 Mixtures |
(Rus) |
|
| Efremov A., Bobylev A., Kwon K. | |||
| 1 - 2 的 2 信息 | |||